Mycronic jet printing technology makes it possible to dispense solder paste for the most challenging circuit boards and components, with micrometer accuracy, maximum speed and perfect quality solder joints.
The jet printer is equipped with high-precision, high-throughput jetting heads that use state-of-the-art motion system with 3G acceleration. At speeds of more than one million dots per hour,
the two ejectors can be used to cover the widest possible range of solder paste dot volumes for very small and large components.
Thanks to a new dual-lane conveyor system and optional extended buffer zone, the next board is
always ready and in jetting position, thus reducing board transfer time to a bare minimum.
Key features:
– 100% software-driven and operator-independent
– State-of-the-art motion system with 3G acceleration which
– Versatile dual-head, dual-lane design
– Automatic board stretch compensation
– Complete volume control and dot consistency
– New 30% narrower design for a smaller footprint
