Capabilities
The capability to operate the most efficient systems and processes is assured by our experience and resources across:
– SMT PCB Assembly – prototypes to volume assembly
– BGA and µBGA Assembly – prototypes to volume assembly
– Placement speeds ranging from 3,500 to 27,000 components per hour
– RoHS and Non RoHS processes
– Smallest component 01005’s
– Smallest pitch 30 microns
– Tallest component 15mm
– Largest component / connectors 45 x 100mm
– Placement of all fine-pitch QFP, BGA, µBGA, CSP packages
– PCB size capability from 50 x 50mm to 460 x 440mm
– Two SMT pick and place lines
